Wire Bonding Equipment
BEI Kimco was able to leverage its strength in magnetic voice coil actuators to enable the latest generation of automated wire bonders. These wire bonders make the necessary connections between the internal die of an integrated circuit and the outside leads that exit the chip package. Current processor chips can take high tens of connections per device. This makes bonding speed very important for volume production. Placement, accuracy and reliability are also absolutely important to help achieve the desired yield and reliability for the devices being manufactured.

Semiconductor Equipment
Semiconductor processing equipment manufacturers are striving to achieve several goals. Their equipment must deal with shrinking feature sizes, requiring an increasing level of precision in the positioning ability of the machinery. At the same time, higher throughput is demanded of the system. This necessitates faster mechanisms, which tends to oppose the goal of superior precision. They must also compete in a global marketplace, which requires that they keep the costs as low as possible, while making faster, more precise mechanisms.

Renewable Energy
Generators and Wind/Water Turbines

Automotive
Adhesive dispensing, robotics, vehicle stability control, automotive radar, and transportation equipment.